Huawei: SoC Kirin 970 engraved in 10 nm and with a mysterious GPU

A leak spread on Chinese social networks again details the SoC Kirin 970, successor to the current Kirin 960 of the Huawei P10 and etched in 10 nm.

The Huawei P10 smartphone boasts a HiSilicon Kirin 960 processor announced at the end of 2016, engraved in 16 nm and already present in the Huawei Mate 9 but rumors about its successor, SoC Kirin 970, come back regularly in recent months. ----- From the Chinese social network Weibo, new indiscretions detail again the characteristics of the next generation, always engraved by Taiwanese TSMC but this time in 10 nm FinFET.
Huawei. © androidauthority.com
The Huawei P10 smartphone boasts a HiSilicon Kirin 960 processor announced at the end of 2016, engraved in 16 nm and already present in the Huawei Mate 9 but rumors about its successor, SoC Kirin 970, come back regularly in recent months.

From the Chinese social network Weibo, new indiscretions detail again the characteristics of the next generation, always engraved by Taiwanese TSMC but this time in 10 nm FinFET.



 


The new SoC should embed ARM Cortex-A73 cores, probably in octocore 4 + 4 configuration, and with a mobile ARM Heimdall (or Heimdallr) GPU which could correspond to the successor of ARM Mali-G71 but still under Bifrost architecture, and That the Kirin 970 would be the first to operate.

The rumor also points to a 4G LTE modem supporting 5-band aggregation and 256-QAM modulation, corresponding to a 4G LTE Cat 12 modem. As a reminder, 
Qualcomm already offers the Cat 4 4G LTE with the SnapDragon 835 and its X16 LTE modem, and announced the 4G LTE Cat 18 with the SnapDragon X20 LTE modem.

 Source : GizmoChina

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