Samsung should
use for the first time a SLP substrate for its Galaxy S9 in order to
reduce the bulk of the printed circuits and allow to integrate a battery
of greater capacity.
While it is
rumored that Apple could use L-type batteries for its next iPhone to
improve their autonomy, it would be surprising that Samsung is not also
looking for solutions to do the same on its own smartphones reference.
Business Korea says that the Korean group will use for the first time in the Galaxy S9 a Substrate Like PCB substrate in place of the usual PCB printed circuit boards.
The advantage of this substrate, derived from HDI PCBs (High Density Interconnected PCBs), is to reduce the bulk of the electronic circuits by stacking them, leaving more room for other elements, and in particular in the case of the Galaxy S9 to ship a larger capacity battery.
Apple would exploit its SLP for its next iPhone in September, with the same purpose to reduce the size of the motherboard. Business Korea suggests that the operation of the SLP announces important changes for the industry, between those who will have the means to dispose of them, such as Samsung or Apple, and the others.
This could lead to the same drastic demand evolutions observed in mobile displays, where the boom in Samsung's in-cell Y-Octa OLED displays, for which the tactile part is directly integrated, has strongly weakened demand for TSP (Touch Screen Panel) modules.
For the Galaxy S9, models with SoC Exynos will benefit from this advanced SLP, while versions with Qualcomm's SoC SnapDragon will remain on the current HDI PCB.
Source : Business Korea
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| Samsung Galaxy S9. © galaxys9.org |
Business Korea says that the Korean group will use for the first time in the Galaxy S9 a Substrate Like PCB substrate in place of the usual PCB printed circuit boards.
* Prix initial : 588.82€.
The advantage of this substrate, derived from HDI PCBs (High Density Interconnected PCBs), is to reduce the bulk of the electronic circuits by stacking them, leaving more room for other elements, and in particular in the case of the Galaxy S9 to ship a larger capacity battery.
Apple would exploit its SLP for its next iPhone in September, with the same purpose to reduce the size of the motherboard. Business Korea suggests that the operation of the SLP announces important changes for the industry, between those who will have the means to dispose of them, such as Samsung or Apple, and the others.
This could lead to the same drastic demand evolutions observed in mobile displays, where the boom in Samsung's in-cell Y-Octa OLED displays, for which the tactile part is directly integrated, has strongly weakened demand for TSP (Touch Screen Panel) modules.
For the Galaxy S9, models with SoC Exynos will benefit from this advanced SLP, while versions with Qualcomm's SoC SnapDragon will remain on the current HDI PCB.
Source : Business Korea
Related:
💌 Follow by Email:Digital Channel
🌍🔍 Search Google :digitalchanneltv.tk
Click Index You Might Be Interested
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