Intel Announces Work on New, More Compact Motherboards for Refined Laptops, Uses AMD for Graphics and HBM2 Memory, All on EMIB Platform to Integrate Components with Different Levels engraving.
The Intel group will soon have a new offer to offer in its family Intel Core 8th generation for laptops always thinner.
Noting that the trend is for ultraportables ever finer but it is complicated to use its own graphics solutions to achieve this goal, the firm of Santa Clara opts for a new approach based on its EMIB technology (Embedded Multi-Die Interconnect Bridge), a solution that brings together components with different levels of etching to create potentially more compact motherboards.
Intel announces the arrival of EMIB designs bringing together an Intel x86 CPU but also an AMD Radeon graphics and HBM2 memory (replacing the dedicated memory GDDR5, more voluminous and energy-consuming), all brought together in a single package.
If EMIB technology is already in use for data center components, this announcement is the first for consumer products. Intel has added a software layer to manage and balance the performance of different components in real time.
Related: Alerte aux médias: une nouvelle famille de processeur Intel Core 8ème génération débutera le 21 août
Intel gives appointment in the first quarter of 2018 (for CES 2018 in Las Vegas?) For the first demonstrations of this new approach that also aims to counter Nvidia and its GPU solutions that occupy a prominent place in growth sectors like artificial intelligence and autonomous car.
Source : Intel
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